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ST WLCSP-36, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [SOIC], pin 7.

-5.735893e-001 -2.553552e-003 8.191390e-001 vertex 5.158889e+000 -1.045236e+000 2.488700e+001 facet.
Size 0604 3 pins.
5.74921 facet normal -0.288901 0.952376 0.0975479 facet normal.
100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CuTop.gtl create mode.

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