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Component Count: 76 Refs C2, C5, C6, C8, C9, C11, C12. - C10, C14 too small for a single 1 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 through hole, DF13-03P-1.25DS, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-171 , 11 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py MLPQ 32 leads, 7x7mm, 0.127mm stencil (https://www.infineon.com/dgdl/ir4301.pdf?fileId=5546d462533600a4015355d5fc691819, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 PQFN 44 leads, 7x7mm, 0.127mm stencil (https://www.infineon.com/dgdl/ir4302.pdf?fileId=5546d462533600a4015355d602a9181d, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 14-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-tdfn-12pin-l123x3c), generated with kicad-footprint-generator XP_POWER ITXxxxxSA SIP DCDC-Converter XP_POWER ITXxxxxSA, SIP, (https://www.xppower.com/pdfs/SF_ITX.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PH series connector, S8B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP-WD, 10 Pin (https://www.ti.com/lit/ds/symlink/tmp461.pdf#page=35 (RUN0010A)), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [QFN] with thermal pad HTSSOP32: plastic thin shrink small outline package; 24 leads; body width 5.3 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 5.08mm TO-126-3, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-247-2, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 2.54mm TO-247-4, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 2.54mm TO-247-4.

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