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BackMount Fuse, 3 x 3 mm, 0.5 mm pitch, ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_5_05-08-1635.pdf TSOT, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_6_3.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.1 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.75 mm² wire, basic insulation, conductor diameter 0.9mm, length 10.0mm, width 3.5mm, e.g. Ettinger 13.13.865, https://katalog.ettinger.de/#p=434 solder Pin_ with flat fork, hole diameter 1.2mm (loose fit), length 10.0mm solder Pin_ with flat with fork, hole diameter 1.3mm, wire diameter 1.0mm (press fit), length 10.0mm solder Pin_ with flat fork, hole diameter 0.7mm, wire diameter 0.8mm wire loop as.
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