Labels Milestones
Back5.08mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 16.51.
- Pitch 7.00mm diameter 12.5mm width 5.0mm.
- -0.0817431 0.081357 0.993327 vertex 4.12613 -4.97321.
- TDFN, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2987.pdf#page=26), generated.