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Back105313-xx08, 8 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator JST SH side entry Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 1-770858-x, 5 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-0421 (alternative finishes: 43045-040x), 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-3210, 32 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_6_05-08-1636.pdf TSOT-23-6 MK06A TSOT-6 Hand-soldering TSOT, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30), generated with kicad-footprint-generator Diode SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/bq24006.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.127 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_8.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770874-x, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SHL top entry Molex LY 20 series connector, S14B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 8x8mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.4.
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