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BackExposed pads, (https://www.onsemi.com/pub/Collateral/511BZ.PDF DFN 0.65P dual flag WDFN-8 1EP 2.2X2.0 0.5P WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1410, with PCB trace layout master PSU/Synth Mages Power Word Stun Panel.kicad_prl create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-EdgeCuts.gm1 create mode 100644 Hardware/PCB/precadsr/precadsr.net delete mode 100644 (0 F.Cu signal (31 "B.Cu" signal (32 "B.Adhes" user "B.Adhesive" 33 "F.Adhes" user "F.Adhesive" (34 "B.Paste" user (35 F.Paste user.
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