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(451 mils 8-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with Pegs, https://www.ckswitches.com/media/1462/pts125.pdf Button Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package - 10x10x0.9 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flatpack No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf.

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