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CC1V-T1A series https://www.microcrystal.com/fileadmin/Media/Products/32kHz/Datasheet/CC1V-T1A.pdf, hand-soldering, 8.0x3.7mm^2 package SMD Crystal Seiko Epson SG-210 https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-210SED, hand-soldering, 2.5x2.0mm^2 package SMD Crystal EuroQuartz MQ series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, 7.0x5.0mm^2 package SMD Crystal FC-135 https://support.epson.biz/td/api/doc_check.php?dl=brief_FC-135R_en.pdf SMD Crystal SERIES SMD7050/4 https://www.foxonline.com/pdfs/FQ7050.pdf, hand-soldering, 7.0x5.0mm^2 package Miniature Crystal Clock Oscillator TG2520 series SMD inductor http://www.bourns.com/docs/Product-Datasheets/SRR1260.pdf SMD Inductor Bourns SRR1260 series SMD inductor http://www.bourns.com/docs/product-datasheets/srp2313aa.pdf Bourns SRR1260 SMD inductor Inductor, Bourns, SRF1260, 12.5mmx12.5mm (Script generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 5/12-H-7.5-ZB Terminal Block, 1719228 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719228), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-15S-0.5SH, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xxx-DV-BE, 37 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator Harwin Gecko Connector, 20 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [QFN]; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 10x10mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.35mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4x4mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 7x7mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8.

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