Labels Milestones

Back

Through-hole, row spacing 15.24 mm (600 mils THT DIP DIL ZIF 7.62mm 300mil PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row.

• If ($bread) { $bread_page_url.
• 1.75094 -8.81921 3 vertex -8.31492.
• 2016 Glider Labs. All rights reserved. Permission.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects