Labels Milestones
Back0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header, 1x27, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole straight socket strip, 2x10, 2.54mm pitch, 8.51mm socket length, single row Through hole angled pin header SMD 1x10 1.00mm single row Through hole angled pin header, 2x12, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x24 2.54mm single row Surface mounted socket strip THT 1x17 2.54mm single row Through hole.
- Resistors 0.005 to 0.2, https://www.vishay.com/docs/30101/wsr.pdf.
- Description="Quad operational amplifier, DIP-14 A-1135.