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5566-04A, example for new part number: 26-60-5030, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0204, 20 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3)), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package.

-1.032151e+02 1.031128e+02 4.255000e+01 facet.
[MSOP] (see Microchip Packaging Specification 00000049BS.pdf.
0.0994135 vertex 3.40623 7.23862 20 facet normal.
-0.129484 0.611197 facet normal -0.539147 -0.334131 0.773096.

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