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Mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 2.29mm IPAK TO-262-3, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 5.45mm TO-264-3, Vertical, RM 1.7mm, MultiwattF-11, staggered type-1, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 1.7mm staggered type-2 TO-220F-15 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Horizontal RM 5.08mm TO-220-2, Vertical, RM 1.7mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220-11, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 1.27mm staggered type-1 TO-220F-2, Horizontal, RM 1.7mm, MultiwattF-11, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 24-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package.

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