Labels Milestones

Back

ZIF 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET M2 MOSFET.

• 39-29-4249, 12 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with.
• 60x10mm^2 drill 1.3mm pad 2.5mm terminal.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects