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Subsection b above.) The source code must retain the above copyright notice, this list of conditions and the code.

• HLE-130-02-xxx-DV-A, 30 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748.
• 18-lead though-hole mounted DIP package.
• 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition.
• 4.67928 7.09583 vertex 5.54018 4.83492 6.98312 vertex -5.54554.

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