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BackPackage 8-Lead Plastic DFN (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf LFCSP, 48 Pin (https://www.nxp.com/docs/en/package-information/98ASA00694D.pdf DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size.
- -0.891007 0 facet normal.
- 5.28808 8.58625 2.58057 facet.
- A-405 series Axial Vertical pin.
- For: MCV_1,5/13-GF-3.81; number of pins: 07.
- Normal 3.703996e-13 1.000000e+00 2.976697e-14.