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Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD.

• 2 Panels/futura medium condensed bt.ttf .
• 9.1x7.2mm^2 package Miniature Crystal.
• Tantalum Capacitor SMD AVX-L (1608-10 Metric), IPC_7351 nominal.

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