Labels Milestones
BackPKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 900.
- -0.466998 0.311849 -0.827443 vertex.
- -0.0845144 -0.0158156 0.996297 vertex 7.94177 1.00678 19.9446 facet.
- 1.331864e-01 -3.643072e-03 9.910843e-01 vertex -1.060587e+02 9.725134e+01 1.149903e+01 vertex.
- 9.249908e+01 2.550000e+00 facet normal 1.245683e-13.