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9x9 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 7.5 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, narrow, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 10.8x11.72mm 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL ZIF 10.16mm 400mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 7x-dip-switch SPST CTS_Series194-7MSTN, Piano, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 22.86.

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