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POWER, Type JTE06 Series, Dual Output DCDC-Converter XP_POWER IHxxxxS, SIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF63R-5P-3.96DSA, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0730, 7 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=295), generated with kicad-footprint-generator connector JST EH series connector, SM03B-SRSS-TB.

0.84961 0.473025 facet normal -0.554748 -0.0546376.
-7.112378e-001 5.735517e-001 facet normal -0.0943136 -0.991505.
-8.095816e-001 -3.787311e-003 5.869951e-001 vertex 4.101425e+000 -2.367393e+000 2.484593e+001.
5.411416e+000 2.496000e+001 vertex -1.851797e+000.

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