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\#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Hardware/PCB/precadsr_aux_Gerbers/precadsr-F_Paste.gbr Normal file Unescape // testing futura vs quentincaps in F6 rendering //font_for_title = default_label_font; title_font_size = 12; label_font_size = 5; height_of_cylinder_indentations = 12; hole_vdist = 44.5; hole_radius = hole_diameter / 2; standoff_radius = hole_radius * 2.5.

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