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Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Stretched Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339 SO, 4 Pin (https://www.onsemi.com/pub/Collateral/MDB8S-D.PDF#page=4), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter.

Http://www.4uconnector.com/online/object/4udrawing/20001.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal.
Vertex 5.043038e+000 1.007356e+000 2.470218e+001 facet normal -0.388724.
Socket 8-lead though-hole mounted DIP package.
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