Labels Milestones
Back1x21 1.00mm single row Through hole angled socket strip, 2x38, 1.27mm pitch, single row Through hole vertical IDC box header, 2x25, 2.54mm pitch, double rows Through hole pin header SMD 1x40 1.00mm single row Through hole angled socket strip THT 1x15 2.54mm single row style2 pin1 right Through hole angled pin header THT 2x27 2.54mm double row Through hole pin header SMD 2x33 2.00mm double row Through hole socket strip SMD 1x19 2.54mm single row Through hole angled pin header SMD 2x30 2.00mm double row Through hole straight pin header, 1x25, 1.27mm pitch, single row Through hole straight socket strip, 1x20, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x33 2.00mm single row Surface mounted socket strip SMD 1x12 1.27mm single row Through hole angled pin header, 2x40, 1.00mm pitch, 2.0mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 2x18, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x39, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x36, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x10, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header, 1x03, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header SMD 2x25 2.00mm double row Through hole Samtec HPM power header series 11.94mm post length, 1x10, 5.08mm pitch, see http://www.vishay.com/docs/88656/kbu4.pdf Vishay KBU rectifier diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_6_05-08-1636.pdf TSOT-23-6 MK06A TSOT-6 Hand-soldering TSOT, 8 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST PH series connector, B09B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-08A, example for new mpn: 39-28-902x, 1 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator ipc_noLead_generator.py WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 4.466x4.395mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 1156 1.
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