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BackSSOP14: plastic shrink small outline package; 28 leads; body width 6.1 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x21 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x25, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header, 2x38, 1.00mm pitch, double rows Surface mounted socket strip SMD 2x26 1.00mm double row surface-mounted straight socket strip, 1x16, 2.54mm pitch, 6mm pin length, double rows Surface mounted socket strip THT 1x28 2.54mm single row Surface mounted socket strip SMD 1x35 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x33 2.54mm double row Through hole pin header SMD 2x14 1.00mm double row Through hole straight pin header, 1x03, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x11 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x23, 2.54mm pitch, double rows Through hole horizontal IDC box header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip SMD 2x27 1.00mm double row.
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