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64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 8x-dip-switch.

• Href="https://gitea.circuitlocution.com/ /arrasta/commit/c9e81f0cc630cea052574ce7c50b3e82145bb626">c9e81f0cc630cea052574ce7c50b3e82145bb626 3.50mm; Angled; threaded flange; footprint includes mount hole.
• Normal -9.700106e-001 -4.799378e-003 2.430151e-001 vertex 5.035938e+000.

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