Labels Milestones
BackST WLCSP-81, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A.
- 1738144 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1738144), generated with kicad-footprint-generator ipc_noLead_generator.py.
- 269f3bf9f9109b69cf4264b79cb1ed6f6a114782 Mon Sep 17.
- -2.963392e+000 -1.681500e-003 vertex 4.666112e-002 -5.840499e+000 2.464800e+001 vertex -4.988278e+000.