synth_tools

Back

Pitch=7.90mm, , length*width=22.4*10.2mm^2, Vishay, TJ4, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Vertical series Radial pin pitch 3.81mm length 9mm width 3.3mm Capacitor C, Rect series, Radial, pin pitch=24.00mm, , diameter=24mm Inductor Radial series Radial pin pitch 23.00mm length 27mm width 11mm Capacitor C, Disc series, Radial, pin pitch=37.50mm, , length*width=41.5*19mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 3.81mm length 5.2mm diameter 2.7mm Vishay IM-2 Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, , length*diameter=5.2*2.7mm^2, , http://www.diodes.com/_files/packages/DO-41%20(Plastic).pdf Diode DO-41_SOD81 series Axial Horizontal pin pitch 10.16mm length 3.2mm diameter 2.6mm Diode, T-1 series, Axial, Horizontal, pin pitch=20.32mm, , length*diameter=17.5*12mm^2, Vishay, IM-10-46, http://www.vishay.com/docs/34030/im10.pdf Inductor Axial series Axial Vertical pin pitch 10.00mm length 11.0mm width 6.3mm Capacitor C, Disc series, Radial, pin pitch=7.50mm 10.00mm, , length*width=13*6.5mm^2, Capacitor C Rect series Radial pin pitch 41mm length 34.5mm diameter 20mm Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=25.4mm, 2W, length*diameter=15.5*5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf Resistor Axial_DIN0207 series Axial Horizontal pin pitch 7.50mm 10.00mm length 11.0mm width 2.8mm solder Pin_ with flat with hole, hole diameter 0.5mm test point wire loop as test Point, diameter 4.0mm 2 pins diameter 5.0mm z-position of LED center 1.0mm, 2 pins, diameter 8.0mm, 3 pins UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.5mm; see section 7.4.

New Pull Request

Labels Milestones