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Fuse, 2 Pin (https://www.bourns.com/data/global/pdfs/TBU-CA.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 8.6, Wuerth electronics 9774025960 (https://katalog.we-online.de/em/datasheet/9774025960.pdf,), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Thin Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/MAX4460-MAX4462.pdf#page=19, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0137.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times 1 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose BM24 series connector, S4B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Inductor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001839B.pdf#page=464), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST EH side entry JST NV side entry Molex Micro-Fit 3.0 Connector System, 43045-1221 (alternative finishes: 43045-200x), 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 4, Wuerth electronics 9774010960 (https://katalog.we-online.de/em/datasheet/9774010960.pdf,), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-M (7260-28 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2 mm² wires, reinforced insulation, conductor.

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