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1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x11, 1.27mm pitch, 4.4mm socket length, double rows Through hole straight pin header, 2x09, 2.54mm pitch, 8.51mm socket.

-7.508180e-001 0.000000e+000 vertex -2.186956e+000.
1.5mm wire loop as test point, loop diameter.

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