Labels Milestones
BackCopal_CVS-08xB, Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils.
- Output DCDC-Converter, CINCON, EC6Cxx.
- SMB(DO-214AA) SMC (DO-214AB) RM10 Handsoldering SMD Thruhole Diode.