Labels Milestones
Back0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.65mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole pin header SMD 1x12 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x35 2.00mm single row style2 pin1 right Through hole angled pin header, 1x10, 2.54mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 2x02 1.27mm double row Through hole socket strip THT 1x15 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x08 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x04 2.00mm single row style2 pin1 right Through hole IDC header, 2x06, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x06 1.27mm double row surface-mounted straight pin header, 1x17, 2.00mm pitch, 4.2mm pin length, single row Through hole straight pin header, 2x38, 1.27mm pitch, 4.0mm pin length, double rows Through hole pin header SMD 1x35 1.27mm single row Through hole straight pin header, 1x01, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted socket strip THT 2x37 1.00mm double row surface-mounted straight socket strip, 2x11, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x29 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x04, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header, 2x27, 1.00mm pitch, 2.0mm pin.
- Vertex 5.995389e-007 7.987200e+000 9.983999e+000 vertex 5.558580e+000 1.123793e+000.
- System, 43045-1200 (alternative finishes: 43045-140x), 7 Pins.
- Connectors, 42819-22XX, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm.