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8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 8-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 2.54mm TO-220F-4, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 1.27mm staggered type-1 TO-220F-15.

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