3
1
Back

Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC box header THT 2x35 2.54mm double row Through hole angled pin header, 2x24, 1.27mm pitch, double rows Through hole IDC header, 2x12, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x21, 1.00mm pitch, 2.0mm pin length, single row Through hole pin header SMD 1x04 1.27mm single row Through hole angled socket strip, 2x10, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x02, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x18, 1.27mm pitch, single row style2 pin1 right Through hole angled.

New Pull Request