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Mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET MF MOSFET.

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