Labels Milestones
BackWLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight pin header, 1x35, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight socket strip, 2x31, 1.00mm pitch, double rows Surface mounted socket strip THT 1x39 2.00mm single row Surface mounted pin header THT 1x30 2.54mm single.
- = 3.25; shaft_height = 13; shaft_smoothness.
- (https://ww2.minicircuits.com/case_style/MMM168.pdf Footprint for Mini-Circuits case TTT167 (https://ww2.minicircuits.com/case_style/TTT167.pdf Footprint.
- Copper, 1mm soldermask opening.