Labels Milestones
BackTHT HC-33/U http://pdi.bentech-taiwan.com/PDI/GEN20SPEV20HC3320U.pdf Crystal THT HC-33/U, http://pdi.bentech-taiwan.com/PDI/GEN20SPEV20HC3320U.pdf Crystal, Quarz, HC35/U, http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/TO71xx.pdf Crystal THT HC-50 http://www.crovencrystals.com/croven_pdf/HC-50_Crystal_Holder_Rev_00.pdf Crystal THT HC-49/U http://5hertz.com/pdfs/04404_D.pdf Crystal THT HC-49/U, 3pin-version, http://www.raltron.com/products/pdfspecs/crystal_hc_49_45_51.pdf Crystal THT HC-50, http://www.crovencrystals.com/croven_pdf/HC-50_Crystal_Holder_Rev_00.pdf Crystal THT HC-33/U, http://pdi.bentech-taiwan.com/PDI/GEN20SPEV20HC3320U.pdf Crystal, Quarz, HC35/U, http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/TO71xx.pdf Crystal THT C26-LF 6.5mm length 2.06mm diameter Crystal THT HC-51 http://www.crovencrystals.com/croven_pdf/HC-51_Crystal_Holder_Rev_00.pdf Crystal THT DS26 6.0mm length 1.9mm diameter http://www.chinafronter.com/wp-content/uploads/2013/12/FM206.pdf SMD Crystal Seiko Epson SG-8002CA https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 7.0x5.0mm^2 package SMD Crystal 2012/2 http://txccrystal.com/images/pdf/9ht11.pdf, hand-soldering, 2.0x1.2mm^2 package Ceramic Resomator/Filter Murata DSS6, http://cdn-reichelt.de/documents/datenblatt/B400/DSN6NC51H.pdf, length*width=7.0x2.5mm^2 package, package length=8.0mm, package width=3.5mm, 2 pins Rectangular size 4.8x2.5mm^2 diameter 2.0mm, hole diameter 1.0mm test point wire loop as test point, loop diameter2.6mm, hole diameter 1.4mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-14A1, example for new part number: 26-60-5150, 15 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf#page=68), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB locator, 4 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xxx-DV-LC, 40 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0630, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lm5017.pdf#page=31), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a short time before it actually gets removed, it CANNOT be undone in most cases. Continue? D952ec97f3 Merge issues to be fixed elsewhere fix/merge_issues Start of LM13700 version.
- MK_VCO/Fireball/Fireball.kicad_sch 6400 lines Latest commits for.
- Tweaks checkpoint after roughing out middle PCB.
- 11852 lines tstamp 189e5c14-d81a-45a9-b8ba-c69582490088) Final revision; added.