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Type011_RT05505HBWC, 5 pins, pitch 3.5mm, size 46.5x8.3mm^2, drill diamater 1.15mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00012_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block WAGO 236-148, 45Degree (cable under 45degree), 9 pins, pitch 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 2.29mm IPAK TO-251-3, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 2.54mm staggered type-1 TO-220-7, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 10.9mm TO-264-3, Horizontal, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 4.58mm IPAK TO-251-2, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 2.29mm IPAK TO-251-3, Horizontal, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 1.7mm IIPAK I2PAK TO-262-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing.

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