Labels Milestones
Back2cb8e5eaf679e30139948d8744800b04487466fc updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf#page=68), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 14 Pin (JEDEC MO-153.
- 1.115112e+01 vertex -1.060587e+02 9.725134e+01.
- Normal -0.679089 -0.550857 0.485175 facet normal 0.995119 0.0979557.
- -15.76 (end -3.68 -15.76 (end.
- USB B receptable with flange.
- Normal -4.080780e-001 6.992349e-001 5.869777e-001 facet normal -0.000129735 -0.113445.