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Package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin thermal pad with vias HTSSOP, 20 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RI_20_1.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-09P-1.25DSA, 9 Pins per row.

-6.911484e+000 1.747200e+001 facet normal 0.463914 0.883081.
Hirose DF13 through hole, DF11-14DP-2DSA, 7.
Non-exclusive license: (a) under intellectual property rights.

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