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HEXDIP DirectFET L4 MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET LA MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry, with latches, PN:G125-MVX2605L1X Harwin Gecko Connector, 34 pins, dual row male, vertical entry Harwin LTek Connector, 14 pins, pitch 5mm, size 50x8.1mm^2, drill diamater 1.4mm, pad diameter 2.5mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_311711_RT137xxHBWC_OFF-022811Q.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00029 pitch 10mm size 25x8.1mm^2 drill 1.1mm pad 2.2mm Terminal Block WAGO 236-112, 45Degree (cable under 45degree), 6 pins, pitch 3.5mm, size 39.5x8.3mm^2, drill diamater 1.3mm, pad diameter 2.7mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_312051_RT045xxUBLC_OFF-022759T.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-101, 45Degree (cable under 45degree), 10 pins, dual row male, vertical entry Harwin LTek Connector, 26 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 9x9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 44 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68)), generated with kicad-footprint-generator Molex.

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