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Https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf, 7.1x2.5mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 10.5x5.0mm^2 package SMD Crystal Oscillator IDT https://www.idt.com/document/dst/xu-family-datasheet#page=17, 7.0x5.0mm IQD Crystal Clock Oscillator EuroQuartz XO91 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO91.pdf, 7.0x5.0mm^2 package SMD Crystal Seiko Epson MC-306 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, hand-soldering, 8.0x3.2mm^2 package SMD Crystal HC-49-SD http://cdn-reichelt.de/documents/datenblatt/B400/xxx-HC49-SMD.pdf, hand-soldering, 11.4x4.7mm^2 package SMD Crystal MicroCrystal MS3V-T1R 5.2mm length 1.4mm diameter http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/MS3V-T1R.pdf SMD Crystal Oscillator Seiko Epson MC-146 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf, hand-soldering, 7.1x2.5mm^2 package SMD Crystal SERIES SMD2520/2 http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf, 5.0x3.2mm^2 package Abracon Miniature Ceramic Smd Crystal ABM3 http://www.abracon.com/Resonators/abm3.pdf, 5.0x3.2mm^2 package Fox TXCO temperature compensated oscillator SMD Crystal Oscillator Seiko Epson SG-210 https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-210SED, hand-soldering, 2.5x2.0mm^2 package SMD Crystal TXC 7A http://txccrystal.com/images/pdf/7a.pdf SMD Crystal Oscillator Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 5.0x3.2mm^2 package Miniature Crystal Clock Oscillator IQXO-70, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 22.86 mm (900 mils), Socket 10-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), Socket 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15.

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