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Omron_A6S-1010x, Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 7.62 mm (300 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 15.24 mm (600 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL ZIF 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (http://www.st.com/resource/en/datasheet/lis331hh.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0404-8-51, 4.

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