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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, area grid, NSMD pad.

• 26.67mm diameter 28mm Bourns 2200 L_Toroid, Horizontal series.
• -2.92547 -1.22714 18.7502 facet normal.
• Additional attack/decay peaks on.

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