Labels Milestones
BackYZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x22 1.00mm single row Through hole angled socket strip THT 2x01 2.00mm double row surface-mounted straight socket strip, 2x27, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x34 1.27mm double row Through hole pin header THT 1x02 2.54mm single row Through hole straight socket strip, 2x28, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x10 2.54mm single row Through hole socket strip THT 2x07 1.00mm double row Through hole angled socket strip, 2x37, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x24.
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