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993mil 42-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220F-15 Vertical RM 1.27mm staggered type-2 TO-220F-4, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 5.08mm TO-126-2, Vertical, RM 2.54mm.

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