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3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad.

• Connector, 15 top-side contacts, 1.0mm pitch, 1.0mm.
• 5.997228e-001 2.252329e-003 8.002046e-001 facet normal.
• -7.90932 -2.4397 19.9688 vertex 7.45736 -3.59127.

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