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Connector, B5P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Hirose series connector, 502494-1370 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, 53398-0671 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Diode SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0330, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 2.5, Wuerth electronics 9774045943 (https://katalog.we-online.de/em/datasheet/9774045943.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x6.64mm 2x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 20-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP Switch SPST Slide 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge package, diameter 9.0mm, pin pitch 12.70mm length 35.56mm width 17.78mm Pulse F L_Toroid, Vertical series, Radial, pin pitch=28.50mm, , diameter=29.8mm, muRATA, 1400series, http://www.murata-ps.com/data/magnetics/kmp_1400.pdf Inductor Radial series Radial pin pitch.

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