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Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header, 1x11, 2.00mm pitch, 6.35mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header THT 2x06 1.00mm double row Through hole IDC header, 2x17, 2.54mm pitch, 6mm pin length, double rows Through hole angled socket strip SMD 2x38 2.54mm double row Through hole angled socket strip THT 1x06 2.54mm single row Surface mounted pin header THT 2x21 1.27mm double row Through hole straight socket strip, 2x17, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip THT 2x16 1.27mm double row Through hole socket strip SMD 1x16 2.00mm single row Through.

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