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Picoflex side entry Molex Sabre Power Connector, 43160-1106, With thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST VH series connector, 504050-0791 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator JST XH vertical boss JST ZE series connector, 505405-0370 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xxx-DV-BE-A, 29 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-770870-x, 3 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad 8-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MO-194 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package; 16 leads; body width 4.4 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, wide, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator JST PUD series connector, B15B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, B12B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (JEDEC MO-153 Var FD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink.

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