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KingTek_DSHP08TJ, Slide, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 7.62mm 300mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-53S-0.5SH, 53 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter.

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