Labels Milestones

Back

1W, dual output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf Abracon Miniature Ceramic Smd Crystal ABM3C http://www.abracon.com/Resonators/abm3c.pdf, 5.0x3.2mm^2 package 14-lead dip package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package for diode bridges, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62.

• IS485, IS486, see http://microrato.ua.pt/main/Actividades/Estagios/Docs/IS485_6.pdf Sharp OPIC IS485.
• Annular, M8 mounting hole 5.3mm m5 iso14580.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects